Definition
A flip-chip interconnection method in which solder bumps on the die reflow onto matching substrate pads and surface tension plus defined solderable areas control the final joint shape and stand-off height.
Application
Used to connect a die face-down to a package substrate with short, distributed electrical paths. C4 technology supports high I/O density and has been a foundational flip-chip interconnect approach for processors and other high-performance packages.
Related search terms
Controlled-collapse solder bump; C4 bump
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Related concepts
Evidence and further reading
- Evidence from research.ibm.comhttps://research.ibm.com/publications/controlled-collapse-reflow-chip-joining
- Evidence from research.ibm.comhttps://research.ibm.com/blog/what-is-computer-chip-packaging