Definition
Panel-level packaging is an advanced semiconductor packaging approach that processes devices on large square or rectangular panels rather than round wafers.
Application
Used to scale advanced and heterogeneous packaging by increasing usable processing area and enabling high-throughput package and chiplet integration on panel formats.
Related concepts
Evidence and further reading
- Evidence from newsroom.lamresearch.comhttps://newsroom.lamresearch.com/panel-level-processing-advanced-semiconductor-packaging-semi-101
- Evidence from newsroom.st.comhttps://newsroom.st.com/media-center/press-item.html/c3358.html