Definition
A sealed front-opening carrier standardized for automated storage, transport, and equipment interfacing of 300 mm semiconductor wafers.
Application
Used in automated fabs to protect wafers from contamination while enabling AMHS transport and load-port docking.
Related search terms
Front Opening Unified Pod; FOUP
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Related concepts
Evidence and further reading
- Evidence from intel.comhttps://www.intel.com/content/www/us/en/history/museum-terminology.html
- Evidence from store-us.semi.orghttps://store-us.semi.org/products/e11900-semi-e119-300-mm%E3%82%A6%E3%82%A7%E3%83%BC%E3%83%8F%E3%81%AE%E5%B7%A5%E5%A0%B4%E9%96%93%E8%BC%B8%E9%80%81%E7%94%A8%E7%8B%AD%E3%83%94%E3%83%83%E3%83%81%E3%83%95%E3%83%AD%E3%83%B3%E3%83%88%E3%82%AA%E3%83%BC%E3%83%97%E3%83%8B%E3%83%B3%E3%82%B0%E3%83%9C%E3%83%83%E3%82%AF%E3%82%B9fobit%E3%81%AE%E6%A9%9F%E6%A2%B0%E4%BB%95%E6%A7%98