Definition
Isotropic etching removes material at comparable rates in multiple directions, producing lateral as well as vertical material removal.
Application
Used when undercut or direction-independent removal is desired, including release, selective recess, cleaning, and some semiconductor failure-analysis processes.
Related search terms
isotropic etching
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Related concepts
Evidence and further reading
- Evidence from lamresearch.comhttps://www.lamresearch.com/product/selective-etch-product-family/
- Evidence from plasma.oxinst.comhttps://plasma.oxinst.com/technologies/rie