Definition
The process of separating an ingot into wafer slices, using methods such as sawing or laser-assisted separation.
Application
Produces semiconductor substrates, including silicon wafers and silicon-carbide wafers.
Related concepts
Evidence and further reading
- Evidence from sumcosi.comhttps://www.sumcosi.com/english/products/process/
- Evidence from disco.co.jphttps://www.disco.co.jp/kabra/index_eg.html