Definition
A saw that slices material with a moving wire using abrasive particles, either fixed to the wire or supplied in a slurry.
Application
Used to slice semiconductor crystals, including silicon and silicon carbide, into wafers.
Related concepts
Evidence and further reading
- Evidence from musashino-denshi.co.jphttps://www.musashino-denshi.co.jp/english/wire_saws/
- Evidence from gti-usa.comhttps://www.gti-usa.com/multi-wire-saws