Definition
A nondestructive imaging technique that uses high-frequency acoustic waves to reveal internal interfaces, voids, cracks and delamination in electronic packages and materials.
Application
Used in package inspection and failure analysis to detect delamination, cracking and other hidden defects without destructively sectioning the device.
Related search terms
Scanning Acoustic Microscopy; C-SAM
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Related concepts
Evidence and further reading
- Evidence from nist.govhttps://www.nist.gov/publications/scanning-acoustic-microscopy-stress-measurements-electronic-packaging