Capacitively Coupled Plasma

06 Plasma, Etch & Pattern Transfer

Notation CCP

Definition

A low-pressure plasma generated primarily by an RF electric field established between facing electrodes, with the process gas ionized in the space between them.

Application

Used in reactive ion etching, plasma cleaning and some deposition systems because electrode RF power can sustain the discharge and establish wafer-bias conditions that influence ion energy and directionality.

Related search terms

Capacitively coupled discharge; parallel-plate plasma

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Related concepts

Evidence and further reading