Definition
A short plasma treatment after photoresist development that removes thin residual resist or “scum” from nominally open areas without performing the main pattern-transfer etch.
Application
Used before etch, implantation, deposition or metallization to ensure features are fully opened, reduce organic residue and improve downstream contact or pattern consistency; oxygen-containing plasmas are common for organic photoresist.
Related search terms
Resist descum; plasma descum
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Related concepts
Evidence and further reading
- Evidence from samcointl.comhttps://www.samcointl.com/news-events/tech-reports/introduction-of-the-single-wafer-aqua-plasma-system/
- Evidence from lamresearch.comhttps://www.lamresearch.com/product/gamma-product-family/