Definition
IC design and physical-layout practices that account for manufacturing-process variability and known yield sensitivities so a design can be fabricated more robustly, not merely pass minimum signoff rules.
Application
Used to detect or reduce lithography hotspots, critical-area sensitivity, marginal vias, density/CMP issues and other yield detractors through foundry-recommended checks, scoring and layout enhancements before tapeout.
Related search terms
Design for manufacturing; manufacturability-aware design
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Related concepts
Evidence and further reading
- Evidence from siemens.comhttps://www.siemens.com/en-gb/products/ic/calibre-design/design-for-manufacturing/
- Evidence from blogs.sw.siemens.comhttps://blogs.sw.siemens.com/calibre/2016/09/19/back-annotating-dfm-enhancements-to-place-route-tools/