Definition
The process condition at which the intended etch objective has been reached—such as complete removal of a target film or attainment of a target depth—so the etch should stop or transition to another step.
Application
Used to control etch completion and limit overetch, underlying-layer loss and wafer-to-wafer variation; an endpoint can be identified from in-situ sensor signals, metrology thresholds or predictive process control.
Related search terms
Etch endpoint; process endpoint
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Related concepts
Evidence and further reading
- Evidence from newsroom.lamresearch.comhttps://newsroom.lamresearch.com/In-situ-Metrology-for-Etch-Endpoint-Detection
- Evidence from newsroom.lamresearch.comhttps://newsroom.lamresearch.com/2000-11-16-Lam-Research-Corporation-Launches-Industrys-First-200-And-300-Mm-Capable-Etch-Product-Line