Definition
The deviation of a wafer's front surface from a specified reference plane with the backside treated as ideally flat, as in a flat-chuck measurement, evaluated with site or global flatness metrics. Bow, warp and total thickness variation describe related but distinct aspects of wafer geometry.
Application
Controlled in incoming-wafer and process metrology because local height error consumes lithography focus margin and can affect bonding, CMP, and handling.
Related search terms
Flatness
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Related concepts
Evidence and further reading
- Evidence from semi.orghttps://www.semi.org/sites/semi.org/files/2024-03/CompilationTerms0124.pdf
- Evidence from semiconductor.alfachemic.comhttps://semiconductor.alfachemic.com/services/ttv-warp-bow.html