Definition
Physical vapor deposition (PVD) is a vacuum deposition process in which source material is physically vaporized, commonly by sputtering or evaporation, and then condenses on the wafer surface.
Application
Used in semiconductor manufacturing to deposit metal and metal-nitride films for contacts, liners, barriers, seed layers, metallization, and related logic and memory structures.
Related concepts
Evidence and further reading
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/semiconductor/products/processes/pvd.html
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/product-library/endura-alps-pvd-alps-co-ni.html