Plasma Uniformity

06 Plasma, Etch & Pattern Transfer

Definition

Plasma uniformity is the spatial consistency of plasma-generated conditions or species across the wafer or process region.

Application

Used as a process-control metric because nonuniform plasma conditions can produce across-wafer differences in etch, deposition, or surface treatment; source geometry and operating conditions are tuned to improve uniformity.

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Plasma process uniformity

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