Definition
A wafer-holding device that applies an electric field through an insulating structure to create electrostatic attraction between the chuck and semiconductor wafer, clamping the wafer without a front-side mechanical clamp.
Application
Used in vacuum and plasma process chambers to hold wafers flat and stable during etch, deposition and other processing; controlled clamping and backside thermal contact help support repeatable wafer temperature and process uniformity.
Related search terms
Wafer electrostatic chuck; electrostatic wafer chuck
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Related concepts
Evidence and further reading
- Evidence from lamresearch.comhttps://www.lamresearch.com/technical-glossary/
- Evidence from patents.google.comhttps://patents.google.com/patent/US20070201180A1/en