Definition
A lithographic and pattern-transfer strategy that uses multiple exposures and/or self-aligned patterning steps to obtain effective feature pitch or density beyond a single patterning step's practical resolution.
Application
Used to fabricate dense semiconductor features when one exposure or pattern-transfer cycle cannot meet the required pitch, including double and quadruple patterning schemes.
Related search terms
multi-patterning
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Related concepts
Evidence and further reading
- Evidence from ieee.orghttps://www.ieee.org/ns/periodicals/EDS/EDS-JULY-2024-HTML-v1/InnerFiles/LandPage.html
- Evidence from imec-int.comhttps://www.imec-int.com/en/press/imec-demonstrates-16nm-pitch-ru-lines-record-low-resistance-obtained-using-semi-damascene