Definition
Pattern collapse is the mechanical deformation, sticking, or toppling of narrow high-aspect-ratio resist or patterned features during nanoscale fabrication, often associated with capillary drying forces and limited feature stiffness.
Application
Controlled by resist dimensions and mechanical properties, rinse/dry conditions, adhesion, and hardmask strategies to reduce lithography defects and preserve printable structures.
Related concepts
Evidence and further reading
- Evidence from research.ibm.comhttps://research.ibm.com/publications/revisit-pattern-collapse-for-14nm-node-and-beyond
- Evidence from research.ibm.comhttps://research.ibm.com/publications/pattern-collapse-mitigation-strategies-for-euv-lithography