Definition
The source material bombarded by energetic particles during sputter deposition, releasing atoms or molecules that can form a thin film on a substrate.
Application
Supplies film material for semiconductor layers such as copper interconnect seed layers, titanium barriers or gate electrodes, and tantalum barriers in copper interconnects.
Related search terms
Sputtering target
Search phrases help you find this entry; their meaning depends on the context shown here.
Related concepts
Evidence and further reading
- Evidence from ul.qucosa.dehttps://ul.qucosa.de/api/qucosa%3A88398/attachment/ATT-0/
- Evidence from jx-nmm.comhttps://www.jx-nmm.com/english/products/sputtering/semiconductor_st/