Definition
Model-based prediction of post-process properties from process and wafer-state information, which may include sensor readings and earlier metrology results.
Application
Estimates results such as film thickness to support run-to-run process control and decisions about physical metrology sampling.
Related concepts
Evidence and further reading
- Evidence from tsapps.nist.govhttps://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=924090
- Evidence from arxiv.orghttps://arxiv.org/pdf/2107.05071