Definition
Measurement of a wafer’s dimensions and shape, including thickness, thickness variation, flatness, bow, and warp.
Application
Qualifies wafer geometry and supplies measurements for wafer-process monitoring and incoming or outgoing wafer quality control.
Related concepts
Evidence and further reading
- Evidence from filmetrics.comhttps://www.filmetrics.com/products/wafer-manufacturing/wafer-metrology
- Evidence from micro-epsilon.comhttps://www.micro-epsilon.com/fileadmin/download/industries/industry-brochure--semiconductor--en.pdf