Definition
The maximum minus minimum wafer thickness within a specified measurement area, evaluated using stated measurement and support conditions.
Application
Used to specify wafer thickness uniformity and assess wafer thinning and bonding processes.
Related concepts
Evidence and further reading
- Evidence from universitywafer.comhttps://www.universitywafer.com/ttv-flatness-ultra-flat-silicon.html
- Evidence from store-us.semi.orghttps://store-us.semi.org/products/3d00400-semi-3d4-guide-for-metrology-for-measuring-thickness-total-thickness-variation-ttv-bow-warp-sori-and-flatness-of-bonded-wafer-stacks