Definition
A cyclic thin-film deposition method based on sequential, self-limiting surface reactions that enable highly conformal films with angstrom-scale thickness control.
Application
Used for high-k dielectrics, gate-stack layers, spacers, liners, barriers and other films on planar and high-aspect-ratio structures in advanced logic, memory and packaging.
Related search terms
Atomic-layer deposition
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Related concepts
Evidence and further reading
- Evidence from asm.comhttps://www.asm.com/our-technology-products/ald
- Evidence from newsroom.lamresearch.comhttps://newsroom.lamresearch.com/Tech-Brief-A-Look-at-Atomic-Layer-Deposition-ALD