Definition
The degree to which a deposited film maintains similar thickness over horizontal surfaces, vertical sidewalls and recessed features of a three-dimensional structure.
Application
Used to judge deposition performance on high-aspect-ratio logic and memory structures; ALD is especially valuable where highly conformal coverage is needed in trenches, vias, gate stacks and 3D NAND features.
Related search terms
Conformal coverage; conformal film deposition
Search phrases help you find this entry; their meaning depends on the context shown here.
Related concepts
Evidence and further reading
- Evidence from asm.comhttps://www.asm.com/our-technology-products/ald
- Evidence from asm.comhttps://www.asm.com/media/3xuppljv/annual-report-2024-asm-final.pdf