Definition
A measure of a deposited film's coverage of surface topography, commonly expressed as a sidewall-to-top or bottom-to-top thickness ratio.
Application
Used to compare deposition processes and assess film coverage inside semiconductor trenches and vias.
Related concepts
Evidence and further reading
- Evidence from web.stanford.eduhttps://web.stanford.edu/class/ee311/NOTES/Deposition_Planarization.pdf
- Evidence from web.mit.eduhttps://web.mit.edu/people/husain/www/SMThesis/Final.pdf