Definition
Plasma-enhanced chemical vapor deposition (PECVD) is CVD that uses a plasma to activate or ionize process gases and drive film-forming reactions.
Application
Used to deposit dielectric and other thin films at substrate temperatures lower than many purely thermal CVD processes, with plasma conditions providing additional control of film formation.
Related search terms
Plasma-Enhanced Chemical Vapor Deposition; Plasma Enhanced CVD
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Related concepts
Evidence and further reading
- Evidence from nist.govhttps://www.nist.gov/laboratories/tools-instruments/nanofab-tool-oxford-plasmalab-100-plasma-enhanced-chemical-vapor
- Evidence from nist.govhttps://www.nist.gov/laboratories/tools-instruments/nanofab-tool-plasma-therm-versaline-high-density-plasma-enhanced